| # | 
 | # Generic thermal sysfs drivers configuration | 
 | # | 
 |  | 
 | menuconfig THERMAL | 
 | 	tristate "Generic Thermal sysfs driver" | 
 | 	help | 
 | 	  Generic Thermal Sysfs driver offers a generic mechanism for | 
 | 	  thermal management. Usually it's made up of one or more thermal | 
 | 	  zone and cooling device. | 
 | 	  Each thermal zone contains its own temperature, trip points, | 
 | 	  cooling devices. | 
 | 	  All platforms with ACPI thermal support can use this driver. | 
 | 	  If you want this support, you should say Y or M here. | 
 |  | 
 | if THERMAL | 
 |  | 
 | config THERMAL_HWMON | 
 | 	bool | 
 | 	depends on HWMON=y || HWMON=THERMAL | 
 | 	default y | 
 |  | 
 | choice | 
 | 	prompt "Default Thermal governor" | 
 | 	default THERMAL_DEFAULT_GOV_STEP_WISE | 
 | 	help | 
 | 	  This option sets which thermal governor shall be loaded at | 
 | 	  startup. If in doubt, select 'step_wise'. | 
 |  | 
 | config THERMAL_DEFAULT_GOV_STEP_WISE | 
 | 	bool "step_wise" | 
 | 	select STEP_WISE | 
 | 	help | 
 | 	  Use the step_wise governor as default. This throttles the | 
 | 	  devices one step at a time. | 
 |  | 
 | config THERMAL_DEFAULT_GOV_FAIR_SHARE | 
 | 	bool "fair_share" | 
 | 	select FAIR_SHARE | 
 | 	help | 
 | 	  Use the fair_share governor as default. This throttles the | 
 | 	  devices based on their 'contribution' to a zone. The | 
 | 	  contribution should be provided through platform data. | 
 |  | 
 | config THERMAL_DEFAULT_GOV_USER_SPACE | 
 | 	bool "user_space" | 
 | 	select USER_SPACE | 
 | 	help | 
 | 	  Select this if you want to let the user space manage the | 
 | 	  lpatform thermals. | 
 |  | 
 | endchoice | 
 |  | 
 | config FAIR_SHARE | 
 | 	bool "Fair-share thermal governor" | 
 | 	help | 
 | 	  Enable this to manage platform thermals using fair-share governor. | 
 |  | 
 | config STEP_WISE | 
 | 	bool "Step_wise thermal governor" | 
 | 	help | 
 | 	  Enable this to manage platform thermals using a simple linear | 
 |  | 
 | config USER_SPACE | 
 | 	bool "User_space thermal governor" | 
 | 	help | 
 | 	  Enable this to let the user space manage the platform thermals. | 
 |  | 
 | config CPU_THERMAL | 
 | 	tristate "generic cpu cooling support" | 
 | 	depends on CPU_FREQ | 
 | 	select CPU_FREQ_TABLE | 
 | 	help | 
 | 	  This implements the generic cpu cooling mechanism through frequency | 
 | 	  reduction, cpu hotplug and any other ways of reducing temperature. An | 
 | 	  ACPI version of this already exists(drivers/acpi/processor_thermal.c). | 
 | 	  This will be useful for platforms using the generic thermal interface | 
 | 	  and not the ACPI interface. | 
 | 	  If you want this support, you should say Y here. | 
 |  | 
 | config SPEAR_THERMAL | 
 | 	bool "SPEAr thermal sensor driver" | 
 | 	depends on PLAT_SPEAR | 
 | 	depends on OF | 
 | 	help | 
 | 	  Enable this to plug the SPEAr thermal sensor driver into the Linux | 
 | 	  thermal framework | 
 |  | 
 | config RCAR_THERMAL | 
 | 	tristate "Renesas R-Car thermal driver" | 
 | 	depends on ARCH_SHMOBILE | 
 | 	help | 
 | 	  Enable this to plug the R-Car thermal sensor driver into the Linux | 
 | 	  thermal framework | 
 |  | 
 | config EXYNOS_THERMAL | 
 | 	tristate "Temperature sensor on Samsung EXYNOS" | 
 | 	depends on (ARCH_EXYNOS4 || ARCH_EXYNOS5) | 
 | 	depends on CPU_THERMAL | 
 | 	help | 
 | 	  If you say yes here you get support for TMU (Thermal Management | 
 | 	  Unit) on SAMSUNG EXYNOS series of SoC. | 
 |  | 
 | config DB8500_THERMAL | 
 | 	bool "DB8500 thermal management" | 
 | 	depends on ARCH_U8500 | 
 | 	default y | 
 | 	help | 
 | 	  Adds DB8500 thermal management implementation according to the thermal | 
 | 	  management framework. A thermal zone with several trip points will be | 
 | 	  created. Cooling devices can be bound to the trip points to cool this | 
 | 	  thermal zone if trip points reached. | 
 |  | 
 | config DB8500_CPUFREQ_COOLING | 
 | 	tristate "DB8500 cpufreq cooling" | 
 | 	depends on ARCH_U8500 | 
 | 	depends on CPU_THERMAL | 
 | 	default y | 
 | 	help | 
 | 	  Adds DB8500 cpufreq cooling devices, and these cooling devices can be | 
 | 	  bound to thermal zone trip points. When a trip point reached, the | 
 | 	  bound cpufreq cooling device turns active to set CPU frequency low to | 
 | 	  cool down the CPU. | 
 |  | 
 | endif |